A new generation of high quality, highly adaptable SAC lead-free solder paste   

Suitable for fine printing and reflow,having a wide process and providing SMT solution for component 01005. This paste offers excellent printing ability during 8 hours' using process.The outstanding reflow process makes it high immersion curve and performs well when welding Cu OSP board. The paste can mixing well with all sizes printing points. Excellent slumping restistence can reduce the production of unregular tin beans. The appearance of welding point is good and can be checked by looking. Void ratio can reach IPC CLASS Ⅲ level and IPC welding paste can be classified as ROL0 class to make it environmental friendly and reliability. It can meet the high requirement of printability,reliability and process efficiency of smartphones,iPads and computors and other products.

Stardard alloy

The size of solder power

Features

1. Environmental friendly:in line with RoHS Directive 2011/65/EU.

2. No halogen:according to EN14582 test,Cl≤900PPM，Br≤900PPM，Cl＋ Br≤1500PPM.

3. High reliability: viod ratio can reach the IPC CLASS Ⅲ level; Halogen-free, IPC grade ROL0.

4. Wide reflux process: good welding performance for complex high density PWB assemblies in air and nitrogen environments. Reduce the amount of tin beads: with the reduction of random tin soldering beads, repair times, the first pass yields will increase.

5. Strong solderability: It can meet the needs of some important lead-free devices, such as CSP, QFN, etc. Suitable for surface coating of various lead-free circuit boards, including: OSP-Cu, immersion Ag, immersion Sn, ENIG, nickel plating, LF HASL.

6. High yield of lead-free reflow welding: welding spots with a diameter of 0.16mm can be complete melted.

7. Less residue: less residue after reflow; light color; no corrosion; high impedance; and the probe can be tested.

8. Excellent printing performance and printing life: stable and consistent printing performance over 8 hours.

9. Excellent repositioning capability: Excellent component repositioning capability can be achieved even in the severe condition for reflow.